High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through

摘要

This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed-through with a small parasitic capacitance to the substrate and a high placing density is presented.